Micro-Volume Dispenser / Dosing Pump
This device is a handheld, motorized dispenser designed for the precise application of fluids like solder paste, red glue, and thermal grease. According to the manufacturer, this is the 4th generation of the product, featuring several structural and mechanical improvements over previous versions.
Key Features
Bearing System: A new integrated bearing system ensures smoother and more consistent dispensing of materials.
Improved Transmission: Features a refined gear and drive mechanism for increased reliability and smoother operation.
Enhanced Structure: The overall design is more robust and aesthetically cleaner, with an enclosure that protects the internal PCB.
Ergonomics: Redesigned for a cleaner look and better handling during long periods of use.
Specifications & Compatibility
The dispenser is available in various sizes to accommodate standard industrial syringe barrels:
Sizes: 5cc, 10cc, 30cc, and 55cc versions.
Market Standards: Compatible with both Japanese-style and US-style (high-end market) syringe formats.
Supported Materials
It is designed to handle a wide range of high-viscosity materials commonly used in electronics assembly and repair, including:
Solder Flux: Rosin or liquid soldering flux.
SMT Materials: Red glue (epoxy) for surface mount components.
Thermal Interface Materials: Thermal paste or silicone grease.
Sealants: Silicone rubber or silicone sealants.
Adhesives: General-purpose glues and various industrial adhesives.
Note: The product typically includes the dispenser mechanism only; the adhesive, paste, or syringes are usually sold separately or provided by the user.
